NeoPhotonics Announces Shipment of 53 Gbaud Linear Driver ICs for Silicon Photonics Based Modulators for 400G Data Center Applications
Limited Availability of Low Power, Compact, Single and Quad GaAs Drivers for Silicon Photonics Modulators for 100G per Wavelength DR1 and DR4 Transceivers
SAN JOSE, Calif., July 8, 2019 /PRNewswire/ -- NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of advanced hybrid photonic integrated circuit based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced that it had shipped early limited volumes of its new 53 Gbaud Linear Driver ICs designed to work with Silicon Photonics based Mach-Zehnder Modulator chips in 100G per wavelength datacenter optical transceiver modules. These high performance Driver ICs are manufactured using NeoPhotonics proven, in-house, Gallium Arsenide (GaAs) wafer fabrication facility and are available in both Single and Quad formats.
Silicon Photonics (SiPho) has emerged as a promising technology for optical data transmission over intermediate reaches of approximately 500 meters (DR) inside datacenters. Several vendors have designed 53 Gbaud SiPho modulator chips which can modulate four separate optical signals using PAM4 encoding to achieve 100Gbps (billion bits per second) on four separate channels, resulting in a total of 400Gbps for the module. These SiPho modulator chip designs generally require a larger voltage swing than is normally produced by the CMOS electronics used in the PAM4 DSP chip. NeoPhotonics Linear Driver IC amplifies the electrical signal so that it is of an appropriate voltage to operate the SiPho modulator and produce the desired optical signal. NeoPhotonics Quad Driver chip combines four separate drivers in a single compact, low power chip designed to support compact pluggable modules such as OSFP and QSFP-DD.
These SiPho based transceivers also need a high power laser to provide the initial input light to the modulator. NeoPhotonics also offers such high power, non-hermetic lasers and has begun volume shipments. These high power DFB lasers are qualified to the non-hermetic test compliance with Telcordia GR-468-CORE Issue 2.
"We are pleased to announce the initial shipments and availability of our 53 Gbaud GaAs Driver ICs just before the Fiber Optic Expo in Tokyo, as these products have been designed and manufactured at our NeoPhotonics Semiconductor GK division in Hachioji City of Tokyo," said Tim Jenks, Chairman and CEO of NeoPhotonics. "Our 53 Gbaud Driver ICs and our high power, non-hermetic DFB lasers, high speed photo-detectors, trans-impedance amplifiers and EML lasers provide designers with several of the key optical components required for the highest speed datacenter transceivers," concluded Mr. Jenks.
NeoPhotonics will exhibit its new driver chips and other lasers and optical ICs for 100G and 400G datacenter applications, along with its suite of coherent components for 100G to 600G Data Center Interconnect (DCI) and Telecom applications, plus its switches and passive products, at the Fiber Optic Expo (FOE) trade show at Aomi Hall in Tokyo, Japan, on Stand 12-43 in Hall B, July 17th to July 19th.
NeoPhotonics is a leading designer and manufacturer of optoelectronic solutions for the highest speed communications networks in telecom and datacenter applications. The Company's products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2015 certified engineering and manufacturing facilities in Silicon Valley (USA), Japan and China. For additional information visit www.neophotonics.com.
Safe Harbor Statement Under the Private Securities Litigation Reform Act of 1995
This press release includes statements that qualify as forward-looking statements under the Private Securities Litigation Reform Act of 1995, including those related to industry trends and expected demand for high speed network applications. Readers are cautioned that these forward-looking statements involve risks and uncertainties and are only predictions based on the company's current expectations, estimates and projections about their respective industry and business, management's beliefs, and certain assumptions made by the company, all of which are subject to change and which may differ materially from actual future events or results. The actual company results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of these risks, uncertainties and assumptions. Certain risks and uncertainties that could cause the company's results to differ materially from those expressed or implied by such forward-looking statements as well as other risks and uncertainties relating to the company's business, are described more fully in the Company's Annual Report on Form 10-K for the year ended December 31, 2018, as well as in the Company's Quarterly Report on Form 10-Q for the three month period ended March 31, 2019, filed with the Securities and Exchange Commission.