Overview

NeoPhotonics has extensive capability in the design, large-scale fabrication, high-volume module manufacturing and commercial deployment of our Advanced Hybrid Photonic Integration products and technologies. The process of designing and manufacturing advanced optoelectronic integrated devices in high volume with predictable, well-characterized performance and low manufacturing costs is complex and multi-faceted. NeoPhotonics has developed these technologies which use multiple materials platforms for photonic integration, and which are required for the design and manufacture of complex, high-performance optoelectronic components, modules, and subsystems for fiber optic networks. The basic elements of NeoPhotonics technology are as follows:

Mixed-material platform and optoelectronic integration technology: NeoPhotonics utilizes a set of proprietary integration platforms that provide optoelectronic functionality on silicon and other integrated compound semiconductor substrates including Indium Phosphide, Gallium Arsenide and Silicon Germanium, and integrated combinations of these platforms. We utilize micron and sub-micron scale structures of multiple Silicon Dioxide and Indium Phosphide waveguides to fabricate optoelectronic functional elements such as lasers, detectors, modulators, interferometers, integrated optical filters, switches, and variable attenuators. NeoPhotonics integrates these functional design elements into optoelectronic devices to achieve a desired functionality and specification that is then incorporated into our products. Similarly, we use Gallium Arsenide and Silicon Germanium integration platforms for drivers, amplifiers, and related high-speed electronic control functions for our integrated optoelectronic devices.

Advanced Hybrid Photonic Integration: Through precise fabrication and positioning of physical features, NeoPhotonics can integrate numerous different optoelectronic devices, which are fabricated on separate wafers from different semiconductor and related materials, matching the material to the function to create improved performance by using the highest performance elements of each type. For example, our hybrid integration allows us to integrate active devices, such as photodiodes or lasers fabricated using Indium Phosphide, with high-performance passive devices, such as interferometers, switches, routers and filters, fabricated on silicon and to mate electronic amplifiers made with Silicon Germanium or drivers made with Gallium Arsenide directly to optical elements made with Silicon or Indium Phosphide.

This ability to combine specific functional elements out of optimized materials not only allows for very compact and low-power components, but also through the intimate coupling of different elements, makes possible completely new functions. An example of this multi-platform architecture is found in the coherent optical communications domain where we intimately couple a passive interferometer, which separates quadrature components carrying information, with photo detectors to turn a high-speed optical signal into data-rich electrical signals for processing.

Hardware and firmware integration: We also sell our products as modules and subsystems which contain electronic hardware and firmware controls that interface directly with our customers’ systems. We design the electronic hardware and develop the firmware for our optical products to meet customer specifications.